Systems and methods that use at least one component to...

Details Systems and methods that use at least one component to... Systems and methods that use at least one component to...

2005-03-01

2005-03-01

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S704000, C361S719000, C174S016100, C165S080200, C165S104330

Reexamination Certificate

active

06862185

ABSTRACT:
One embodiment of the invention is a system comprising a first component that generates heat, and a second component that is thermally connected to the first component, wherein the heat from the first component is transferred to a coolant through the second component, and the second component has a function in the computer system associated with an operation of the system other than transferring heat.

REFERENCES:
patent: 4755146 (1988-07-01), Rishworth et al.
patent: 5172873 (1992-12-01), Lum
patent: 5198965 (1993-03-01), Curtis et al.
patent: 5208729 (1993-05-01), Cipolla et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5313097 (1994-05-01), Haj-Ali-Ahmadi et al.
patent: 5390078 (1995-02-01), Taylor
patent: 5861666 (1999-01-01), Bellaar
patent: 5986882 (1999-11-01), Ekrot et al.
patent: 5986887 (1999-11-01), Smith et al.
patent: 6262890 (2001-07-01), Dhawan et al.
patent: 6297960 (2001-10-01), Moden et al.
patent: 6351386 (2002-02-01), Fischbach et al.
patent: 6421240 (2002-07-01), Patel
patent: 6424532 (2002-07-01), Kawamura
patent: 6519157 (2003-02-01), Xing

Affiliated with

Also associated with

Rating

Systems and methods that use at least one component to... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods that use at least one component to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods that use at least one component to... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3447136