Systems and methods of imprint lithography with adjustable mask

Details Systems and methods of imprint lithography with adjustable mask Systems and methods of imprint lithography with adjustable mask

2007-11-13

2007-11-13

Rutledge, D. (Department: 2851)

Photocopying

Projection printing and copying cameras

Detailed holder for original

C355S078000, C101S368000

Reexamination Certificate

active

11000869

ABSTRACT:
Systems and methodologies are provided that account for surface variations of a wafer by adjusting grating features of an imprint lithography mask. Such adjustment employs piezoelectric elements as part of the mask, which can change dimensions (e.g., a height change) and/or move when subjected to an electric voltage. Accordingly, by regulating the amount of electric voltage applied to the piezoelectric elements a controlled expansion for such elements can be obtained, to accommodate for topography variations of the wafer surface.

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patent: 2005/0264132 (2005-12-01), Choi et al.
patent: 2005/0264134 (2005-12-01), GanapathiSubramanian et al.

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