Systems and methods for wafer polishing

Details Systems and methods for wafer polishing Systems and methods for wafer polishing

2007-04-10

2007-04-10

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S054000, C451S285000

Reexamination Certificate

active

11063384

ABSTRACT:
An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the polishing of a wafer by attracting or repelling the slurry to a portion or portions of the substrate.

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U.S. Appl. No. 11/158,450, filed Jun. 21, 2005; First Non-Final Office Action, PTO Date Mailed Feb. 15, 2006.

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