Systems and methods for thermal management

Details Systems and methods for thermal management Systems and methods for thermal management

2009-05-27

2011-10-04

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S703000, C361S707000, C361S709000, C361S716000, C165S185000, C174S547000, C174S548000

Reexamination Certificate

active

08031470

ABSTRACT:
A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively. The first and second conductive paths are independent from each other.

REFERENCES:
patent: 5157577 (1992-10-01), Balaud
patent: 5461542 (1995-10-01), Kosak et al.
patent: 5710804 (1998-01-01), Bhame et al.
patent: 5894407 (1999-04-01), Aakula et al.
patent: 5905244 (1999-05-01), Smith
patent: 5930116 (1999-07-01), Palmer
patent: 5946193 (1999-08-01), Hendrix et al.
patent: 6038129 (2000-03-01), Falaki et al.
patent: 6082441 (2000-07-01), Boehmer et al.
patent: 6142595 (2000-11-01), Dellapi et al.
patent: 6229707 (2001-05-01), Keenan
patent: 6310772 (2001-10-01), Hutchinson et al.
patent: 6452810 (2002-09-01), Wilcox
patent: 6512669 (2003-01-01), Goodwin
patent: 6556443 (2003-04-01), Wei
patent: 6579029 (2003-06-01), Sevde et al.
patent: 6621712 (2003-09-01), Siira
patent: 6788535 (2004-09-01), Dodgen et al.
patent: 6995978 (2006-02-01), Strauss
patent: 7027300 (2006-04-01), Lord
patent: 7116555 (2006-10-01), Kamath et al.
patent: 7130193 (2006-10-01), Hirafuji et al.
patent: 7177154 (2007-02-01), Lee
patent: 7245485 (2007-07-01), Morrell
patent: 7277286 (2007-10-01), Lee
patent: 7355848 (2008-04-01), Hodge et al.
patent: 7450382 (2008-11-01), Fischer et al.
patent: 7457123 (2008-11-01), Wayman
patent: 7495169 (2009-02-01), Adducci
patent: 7652880 (2010-01-01), Wayman
patent: 7719856 (2010-05-01), Nelson et al.
patent: 7724521 (2010-05-01), Nelson et al.
patent: 7864534 (2011-01-01), Wayman et al.
patent: 2003/0016515 (2003-01-01), Jackson
patent: 2003/0031002 (2003-02-01), Siira
patent: 2003/0193774 (2003-10-01), Shyr
patent: 2004/0222517 (2004-11-01), Robertson
patent: 2005/0168941 (2005-08-01), Sokol et al.
patent: 2006/0158866 (2006-07-01), Peterson
patent: 2006/0196640 (2006-09-01), Siu
patent: 2006/0246276 (2006-11-01), Chung
patent: 2007/0025068 (2007-02-01), Chen
patent: 2007/0247809 (2007-10-01), McClure
patent: 2008/0043425 (2008-02-01), Hebert et al.
patent: 2008/0237420 (2008-10-01), Wayman et al.
patent: 2008/0238270 (2008-10-01), Wayman et al.
patent: 2008/0239632 (2008-10-01), Wayman
patent: 2008/0239669 (2008-10-01), Wayman
patent: 2008/0239673 (2008-10-01), Wayman
patent: 2008/0239688 (2008-10-01), Casey et al.
patent: 2008/0278912 (2008-11-01), Zavadsky et al.
patent: 2009/0231815 (2009-09-01), Kim et al.
patent: 2009/0309467 (2009-12-01), Nelson et al.
patent: 2009/0310972 (2009-12-01), Wayman et al.
patent: 2009/0311969 (2009-12-01), Wayman et al.
patent: 2009/0311974 (2009-12-01), Nelson et al.
patent: 19515122 (1996-10-01), None
Translation of Wolf, German patent DE 195 15 122 A1, published on Oct. 31, 1996, translated on Feb. 1, 2011.

Affiliated with

Also associated with

Rating

Systems and methods for thermal management does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods for thermal management, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for thermal management will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4273035