Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-12-12
2006-12-12
Nguyen, Vinh (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S757020, C324S754120, C250S208100, C438S017000
Reexamination Certificate
active
07148715
ABSTRACT:
Systems and methods for testing microelectronic imagers and microfeature devices are disclosed herein. In one embodiment, a method includes providing a microfeature workpiece including a substrate having a front side, a backside, and a plurality of microelectronic dies. The individual dies include an integrated circuit and a plurality of contact pads at the backside of the substrate operatively coupled to the integrated circuit. The method includes contacting individual contact pads with corresponding pins of a probe card. The method further includes testing the dies. In another embodiment, the individual dies can further comprise an image sensor at the front side of the substrate and operatively coupled to the integrated circuit. The image sensors are illuminated while the dies are tested.
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Akram Salman
Hiatt William M.
Kirby Kyle K.
Watkins Charles M.
Wood Alan G.
Chan Emily Y
Dickstein & Shapiro LLP
Nguyen Vinh
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