Systems and methods for sensing obstructions associated with...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S750010, C324S754090, C324S757020

Reexamination Certificate

active

11217747

ABSTRACT:
Systems and methods for sensing obstructions associated with electrical testing of microfeature workpieces are disclosed. An apparatus in accordance with one embodiment includes a first support member configured to releasably carry a microfeature workpiece, a second support member positioned proximate to the first support member and configured to carry an electrical testing device, wherein at least one of the first and second support members is movable toward and away from the other. The apparatus can further include a signal source (e.g., radiation source) positioned proximate to the support member, and a signal sensor (e.g., a radiation sensor) positioned at least proximate to the first support member and the signal source. The signal sensor can be configured to received at least a portion of the signal directed by the signal source and passing proximate to the first support member. Accordingly, the signal source and signal sensor can be used to detect obstructions carried by the first support member and/or the microfeature workpiece.

REFERENCES:
patent: 4864227 (1989-09-01), Sato
patent: 4878114 (1989-10-01), Huynh et al.
patent: 4929893 (1990-05-01), Sato et al.
patent: 4931962 (1990-06-01), Palleiko
patent: 5058178 (1991-10-01), Ray
patent: 5064291 (1991-11-01), Reiser
patent: 5103095 (1992-04-01), Elings et al.
patent: 5245863 (1993-09-01), Kajimura et al.
patent: 5333495 (1994-08-01), Yamaguchi et al.
patent: 5581082 (1996-12-01), Hansma et al.
patent: 5864054 (1999-01-01), Smith, Jr.
patent: 5955661 (1999-09-01), Samsavar et al.
patent: 6111419 (2000-08-01), Lefever et al.
patent: 6241456 (2001-06-01), Kato et al.
patent: 6267005 (2001-07-01), Samsavar et al.
patent: 6388457 (2002-05-01), Loh et al.
patent: 6389885 (2002-05-01), Arnold et al.
patent: 6480286 (2002-11-01), Kubo et al.
patent: 6779386 (2004-08-01), Neo et al.
patent: 6812045 (2004-11-01), Nikoonahad et al.
patent: 6923045 (2005-08-01), Neo et al.
patent: 7057408 (2006-06-01), Schneidewind et al.
patent: 7126145 (2006-10-01), Ueda
patent: 2005/0229684 (2005-10-01), Neo et al.
patent: 0 898 300 (1999-02-01), None
patent: 03-030352 (1991-02-01), None
patent: 04-092444 (1992-03-01), None
patent: 09-281016 (1997-10-01), None
Olympus Systems, Inc., “Electroglas Spares,” 1 page, retrieved from the Internet on Aug. 9, 2005, <http://www.proberspares.com/index.html>.
Olympus Systems, Inc., “Electroglas Wafer Probers,” 1 page, retrieved from the Internet on Aug. 9, 2005, <http://www.proberspares.com/probers.html>.
Accretech—Tokyo Seimitsu Co. Ltd., “Wafer Probing Machines,” 4 pages, retrieved from the Internet on Aug. 9, 2005, <http://www.accretech.jp/products-en/semicon/wafer—pm>.
Mitsubishi Materials Corporation, “Surface Roughness,” 2 pages, 2000, retrieved from the Internet on Jul. 4, 2001, <http://www.mitsubishicarbide.com/english/reference/hyoumenarasa.htm>.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Systems and methods for sensing obstructions associated with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods for sensing obstructions associated with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for sensing obstructions associated with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3733048

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.