Systems and methods for providing high-density capacitors

Details Systems and methods for providing high-density capacitors Systems and methods for providing high-density capacitors

2009-05-05

2011-12-27

Malsawma, Lex (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE29342, C257SE21008, C438S381000, C361S303000

Reexamination Certificate

active

08084841

ABSTRACT:
The present invention describes systems and methods for providing high-density capacitors. An exemplary embodiment of the present invention provides a high-density capacitor system comprising a substrate and a porous conductive layer formed on the substrate, wherein the porous conductive layer is formed in accordance with a predetermined pattern. Furthermore, the high-density capacitor system includes a dielectric material formed on the porous conductive layer and a second conductive layer formed on the dielectric material. Additionally, the high-density capacitor system includes a plurality of conductive pads configured in communication with the second conductive layer.

REFERENCES:
patent: 5138412 (1992-08-01), Hieda et al.
patent: 5763911 (1998-06-01), Matthews et al.
patent: 6304426 (2001-10-01), Wei et al.
patent: 6638830 (2003-10-01), Tsai et al.
patent: 6872591 (2005-03-01), Wang et al.
patent: 6911373 (2005-06-01), Kellar et al.
patent: 6982472 (2006-01-01), Kiyotoshi
patent: 7262075 (2007-08-01), Aggarwal et al.
patent: 2004/0264101 (2004-12-01), Hill
patent: 2005/0141171 (2005-06-01), Borland
patent: 2005/0274227 (2005-12-01), Aggarwal et al.
patent: 2006/0258327 (2006-11-01), Lee et al.
patent: 2006/0269762 (2006-11-01), Pulugurtha et al.
patent: 2007/0040204 (2007-02-01), Pulugurtha et al.
patent: 2007/0187739 (2007-08-01), Liu et al.
patent: 2008/0216298 (2008-09-01), Dudnikov
patent: 2009/0101956 (2009-04-01), Booth, Jr. et al.
Kumar, Manish, “High Density and High Reliability Thin Film Embedded Capacitors on Organic and Silicon Substrates”, Master of Science Thesis, Georgia Institute of Technology, Dec. 2008, (abstract) [online]. Retrieved from the Internet on Jun. 9, 2010. Retrieved from: <URL:https://smartech.gatech.edu/bitstream/1853126655/1/Kumar—Manish—200812—MS.pdf.
International Search Report and Written Opinion dated Jun. 22, 2010 for related PCT Application No. PCT/US2010/031938.
International Search Report and Written Opinion dated Jun. 29, 2010 for PCT Application No. PCT/US2010/032107.

Affiliated with

Also associated with

Rating

Systems and methods for providing high-density capacitors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods for providing high-density capacitors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for providing high-density capacitors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4316814