Systems and methods for multi-dimensional metrology and/or...

Optics: measuring and testing – Dimension

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C356S602000, C356S631000

Reexamination Certificate

active

07126699

ABSTRACT:
Systems and methods for multi-dimensional metrology and inspection of a specimen such as a bumped wafer are provided. One method includes scanning the specimen with partial oblique illumination to form an image of the structure, either through the normal collection angle or through an oblique collection angle. The method also includes integrating an intensity of the image and determining a height of the structure from the integrated intensity. The integrated intensity may be approximately proportional or inversely proportional to the height of the structure. In addition, the method may include scanning the specimen with bright field illumination to form a bright field image of the specimen. The method may also include determining a lateral dimension of the structure from the bright field image. Furthermore, the method may include detecting defects on the specimen from the bright field image or the obliquely-illuminated image.

REFERENCES:
patent: 4063820 (1977-12-01), Borgese
patent: 5999266 (1999-12-01), Takahashi et al.
patent: 6181472 (2001-01-01), Liu
patent: 6268923 (2001-07-01), Michniewicz et al.
patent: 6603103 (2003-08-01), Ulrich et al.
patent: 2002/0018118 (2002-02-01), Coulombe et al.
patent: 00/36525 (2000-06-01), None
patent: 01/71279 (2001-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Systems and methods for multi-dimensional metrology and/or... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods for multi-dimensional metrology and/or..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for multi-dimensional metrology and/or... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3651534

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.