Optics: measuring and testing – Dimension
Reexamination Certificate
2006-10-24
2006-10-24
Rosenberger, Richard A. (Department: 2877)
Optics: measuring and testing
Dimension
C356S602000, C356S631000
Reexamination Certificate
active
07126699
ABSTRACT:
Systems and methods for multi-dimensional metrology and inspection of a specimen such as a bumped wafer are provided. One method includes scanning the specimen with partial oblique illumination to form an image of the structure, either through the normal collection angle or through an oblique collection angle. The method also includes integrating an intensity of the image and determining a height of the structure from the integrated intensity. The integrated intensity may be approximately proportional or inversely proportional to the height of the structure. In addition, the method may include scanning the specimen with bright field illumination to form a bright field image of the specimen. The method may also include determining a lateral dimension of the structure from the bright field image. Furthermore, the method may include detecting defects on the specimen from the bright field image or the obliquely-illuminated image.
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Hiebert Stephen
Kole Frank
Schmidley Richard
Wihl Tim
Daffer McDaniel LLP
KLA-Tencor Technologies Corp.
Mewherter Ann Marie
Rosenberger Richard A.
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