Systems and methods for measuring relative thermal expansion...

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – Specified electrical sensor or system

Reexamination Certificate

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Reexamination Certificate

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07069790

ABSTRACT:
Systems and methods for accurately comparing the thermal expansion coefficient of components (materials substrate, etc.) to be attached in some manner. This invention utilizes the frequency output of a double-ended quartz resonator bonded to first and second reference components to generate waveforms when the components are subjected to a temperature change. The waveforms are compared to determine the thermal expansion compatibility of the components.

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patent: 6634231 (2003-10-01), Malametz
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patent: 6938334 (2005-09-01), Yu

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