Semiconductor device manufacturing: process – Miscellaneous
Reexamination Certificate
2006-02-22
2008-12-30
Dang, Phuc T (Department: 2892)
Semiconductor device manufacturing: process
Miscellaneous
C438S597000, C257S259000, C118S052000
Reexamination Certificate
active
07470638
ABSTRACT:
A semiconductor substrate undergoing processing to fabricate integrated circuit devices thereon is spun about a rotational axis while introducing liquid onto a surface of the substrate. An annular-shaped sheet of liquid is formed on the surface, the sheet of liquid having an inner diameter defining a liquid-free void. The size of a diameter of the void is reduced by manipulation of the annular-shaped sheet of liquid. The void may then be enlarged until the surface is substantially dry. The annular-shaped sheet of liquid may be formed and altered by selectively moving a contact area on the surface of the substrate on which the liquid is introduced. Systems for processing a substrate and configured to deposit and manipulate a sheet of liquid thereon are also disclosed.
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Mori Hiroyuki
Shirley Paul D.
Dang Phuc T
Micro)n Technology, Inc.
TraskBritt
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