Systems and methods for laser-assisted plasma processing

Electric heating – Metal heating – By arc

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C219S121360, C219S121470

Reexamination Certificate

active

10913739

ABSTRACT:
A controllable heat source, such as a laser or flame torch, can be used to pre-heat a portion of the surface of a workpiece, such as a glass optic or semiconductor wafer. Reactive atom plasma (RAP) processing can be used to modify the pre-heated surface portion, as the pre-heated material will more readily chemically combine with the atomic radicals of the precursor in the plasma. A RAP torch, such as an ICP plasma torch, MIP plasma torch, or flame torch, can be used to shape, polish, etch, planarize, deposit, chemically modify and/or redistribute material on the surface of the workpiece. The material modified by the torch can substantially correspond to the pattern or portion of the surface that was pre-heated by the heat source. This description is not intended to be a complete description of, or limit the scope of, the invention. Other features, aspects, and objects of the invention can be obtained from a review of the specification, the figures, and the claims.

REFERENCES:
patent: 4532199 (1985-07-01), Ueno
patent: 4689467 (1987-08-01), Inoue
patent: 5256205 (1993-10-01), Schmitt, III
patent: 5321224 (1994-06-01), Kamimura et al.
patent: 5429730 (1995-07-01), Nakamura et al.
patent: 5639699 (1997-06-01), Nakamura et al.
patent: 5683548 (1997-11-01), Hartig
patent: 5795493 (1998-08-01), Bukhman et al.
patent: 6229111 (2001-05-01), McCay et al.
patent: 6238587 (2001-05-01), Siniaguine et al.
patent: 6660177 (2003-12-01), Carr
patent: WO 02/61171 (2002-08-01), None
patent: 0 546 842 (1993-06-01), None
International Search Report Mailed Oct. 31, 2005.
Supplementary European Search Report, EPO, mailed Dec. 21, 2006, 4 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Systems and methods for laser-assisted plasma processing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods for laser-assisted plasma processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for laser-assisted plasma processing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3876189

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.