Systems and methods for inspecting wafers

Details Systems and methods for inspecting wafers Systems and methods for inspecting wafers

2008-10-07

2009-11-24

Nguyen, Sang (Department: 2886)

Optics: measuring and testing

Inspection of flaws or impurities

Surface condition

C356S237400, C356S394000

Reexamination Certificate

active

07623229

ABSTRACT:
Systems and methods for inspecting wafers are provided. One system includes a detection subsystem configured to separately and simultaneously detect light scattered from different portions of a single spot obliquely, or normally, illuminated on a wafer and to separately generate output responsive to the separately detected light that can be used to detect defects on the wafer. The system can, therefore, effectively perform a multi-spot type of inspection of the wafer using only a single obliquely or normally illuminated spot on the wafer.

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