Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-05-01
2010-06-01
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21511
Reexamination Certificate
active
07727806
ABSTRACT:
A method for forming a device, comprising providing a first substrate carrying a first set of components disposed in a first encapsulating layer over the first set of components, providing a second substrate carrying a second set of components disposed in a second encapsulating layer over the second set of components, bonding the first and second substrates and functionally interconnecting at least one of the predefined components in the first set of components with at least one of the components in the second set of components.
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Davis Seth M.
Racz Livia M.
Shanfield Stanley R.
Uhland Scott A.
White Douglas W.
Charles Stark Draper Laboratory, Inc.
Coleman W. David
Goodwin & Procter LLP
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