Systems and methods for forming tantalum oxide layers and...

Organic compounds -- part of the class 532-570 series – Organic compounds – Heavy metal containing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S785000

Reexamination Certificate

active

07858815

ABSTRACT:
A method of forming (and apparatus for forming) a tantalum oxide layer on a substrate, particularly a semiconductor substrate or substrate assembly, using a vapor deposition process and a tantalum precursor compound that includes alkoxide ligands, for example.

REFERENCES:
patent: 4525468 (1985-06-01), Mack et al.
patent: 5256244 (1993-10-01), Ackerman
patent: 5401305 (1995-03-01), Russo et al.
patent: 5462014 (1995-10-01), Awaya et al.
patent: 5468687 (1995-11-01), Carl et al.
patent: 5480488 (1996-01-01), Bittner et al.
patent: 5487918 (1996-01-01), Akhtar
patent: 5599387 (1997-02-01), Neuman et al.
patent: 5780115 (1998-07-01), Park et al.
patent: 5820664 (1998-10-01), Gardiner et al.
patent: 5820994 (1998-10-01), Gotoh et al.
patent: 5863337 (1999-01-01), Neuman et al.
patent: 5948322 (1999-09-01), Baum et al.
patent: 5989623 (1999-11-01), Chen et al.
patent: 6037001 (2000-03-01), Kaloyeros et al.
patent: 6118146 (2000-09-01), Park et al.
patent: 6133086 (2000-10-01), Huang et al.
patent: 6146959 (2000-11-01), DeBoer et al.
patent: 6200658 (2001-03-01), Walther et al.
patent: 6200847 (2001-03-01), Kishiro
patent: 6207302 (2001-03-01), Sugiura et al.
patent: 6265260 (2001-07-01), Alers et al.
patent: 6328947 (2001-12-01), Monden et al.
patent: 6448187 (2002-09-01), Yau et al.
patent: 6461982 (2002-10-01), DeBoer et al.
patent: 6482477 (2002-11-01), Westhoff et al.
patent: 6487918 (2002-12-01), DeAngelis
patent: 6534395 (2003-03-01), Werkhoven et al.
patent: 6548424 (2003-04-01), Putkonen
patent: 6596602 (2003-07-01), Iizuka et al.
patent: 6784049 (2004-08-01), Vaartstra
patent: 6919243 (2005-07-01), Chung et al.
patent: 6932867 (2005-08-01), Ritala et al.
patent: 6939579 (2005-09-01), Bondestam et al.
patent: 6998014 (2006-02-01), Chen et al.
patent: 7030042 (2006-04-01), Vaartstra et al.
patent: 7368402 (2008-05-01), Vaartstra et al.
patent: 2001/0036752 (2001-11-01), DeBoer et al.
patent: 2001/0041250 (2001-11-01), Werkhoven et al.
patent: 2002/0094634 (2002-07-01), Chung et al.
patent: 2002/0102810 (2002-08-01), Iizuka et al.
patent: 2002/0157611 (2002-10-01), Bondestam et al.
patent: 2003/0143328 (2003-07-01), Chen et al.
patent: 2003/0188682 (2003-10-01), Tois et al.
patent: 2004/0018735 (2004-01-01), Park et al.
patent: 2004/0043633 (2004-03-01), Vaartstra
patent: 2005/0009266 (2005-01-01), Vaartstra
patent: 2006/0178019 (2006-08-01), Senzaki et al.
patent: 1205574 (2002-05-01), None
patent: 2001-181288 (1999-12-01), None
patent: WO 95/26355 (1995-10-01), None
patent: WO 01/40541 (2001-06-01), None
Chaneliere et al., “Dielectric Permittivity of Amorphous and Hexagonal Electron Cyclotron Resonance Plasma Deposited Ta2O5Thin Films,”Electrochemical and Solid-State Letters, Jun. 1999; 2(6):291-3.
Grant&Hackh's Chemical Dictionary, McGraw-Hill Book Company, 5thedition, 1987:221.
Hawley,The Condensed Chemical Dictionary, 10thEdition, Van Nostrand Reinhold Co., New York, 1981; 225-226.
Jiménez et al., “Deposition of Ta2O5and (Tio2)-(Ta2O5) films from Ta(OEt)4(DMAE) and Ti(OEt)2(DMAE)2, by IMOCVD,”J. Phys. IV France, 1999; 9:Pr8-569-Pr8-573.
Kishiro et al., “Structure and Electrical Properties of Thin Ta2O5Deposited on Metal Electrodes,”Jpn. J. Appl. Phys., Mar. 1998; 37(3B):1336-9.
Lin et al., “Ta2O5thin films with exceptionally high dielectric constant,”Applied Physics Letter, Apr. 1999; 74(16):2370-2.
“Material Safety Data Sheet- Catalog # 235733, Name: 1,1,3,3-Tetramethyldisiloxane, 97%”Aldrich Chemical Co., Inc. [online]. [retrieved Jun. 23, 2003]. Retrieved from the internet<http://infonew.sigma-aldrich.com/cgi-bin/gx.cgi/Applogic+MSDSInfo.ReturnMSDS>;3 pgs. Valid May-Jul. 2003.
“Material Safety Data Sheet- Catalog # 326739, Name: Hexamethyldisiloxane, 99.5+%, NMR Grade,”Aldrich Chemical Co., Inc. [online]. [retrieved Jun. 23, 2003]. Retrieved from the internet: <http://infonew.sigma-aldrich.com/cgi-bin/gx.cgi/Applogic+MSDSInfo.ReturnMSDS>;3 pgs. Valid May-Jul. 2003.
“Refractory” and “Refractory metal,”Webster's New Universal Unabridged Dictionary, Avenel, New Jersey, 1992; p. 1207.
Vehkamäki et al., “Growth of SrTiO3and BaTiO3Thin Films by Atomic Layer Deposition,”Electrochemical and Solid-State Letters, Oct. 1999; 2(10):504-506.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Systems and methods for forming tantalum oxide layers and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods for forming tantalum oxide layers and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for forming tantalum oxide layers and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4232681

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.