Systems and methods for distributing I/O in a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Details

C257S758000, C257S778000, C257S786000, C438S618000, C438S612000, C438S667000

Reexamination Certificate

active

11530550

ABSTRACT:
Various systems and methods for implementing multi-mode semiconductor devices are discussed herein. For example, a multi-mode semiconductor device is disclosed that includes a device package with a number of package pins. In addition, the device includes a semiconductor die with at least two IO buffers. One of the IO buffers is located a distance from a particular package pin and another of the IO buffers is located a greater distance from the particular package pin. The IO buffer located closest to the package pin includes first bond pad electrically coupled to a circuit implementing a first interface type and a first floating bond pad, and the other IO buffer includes a second bond pad electrically coupled to a circuit implementing a second interface type and a second floating bond pad. In some cases, the first floating bond pad is electrically coupled to the circuit implementing the second interface type via a metal layer wire, and the first floating bond pad is electrically coupled to the particular package pin.

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