Systems and methods for determining a characteristic of a...

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C356S237500

Reexamination Certificate

active

07463349

ABSTRACT:
Systems and methods for determining a characteristic of a specimen are provided. One system includes an illumination subsystem configured to direct light to a first set of spots on the specimen at a normal angle of incidence and to simultaneously direct light to a second set of spots on the specimen at an oblique angle of incidence. The system also includes a detection subsystem configured to detect light scattered from the first and second sets of spots simultaneously and to generate first output responsive to the light scattered from the first set of spots and second output responsive to the light scattered from the second set of spots. The first and second outputs can be used to determine the characteristic of the specimen.

REFERENCES:
patent: 5274434 (1993-12-01), Morioka et al.
patent: 5798829 (1998-08-01), Vaez-Iravani
patent: 6201601 (2001-03-01), Vaez-Iravani et al.
patent: 6538730 (2003-03-01), Vaez-Iravani et al.
patent: 6791680 (2004-09-01), Rosengaus et al.
patent: 2004/0042001 (2004-03-01), Vaez-Iravani et al.
patent: 2006/0197946 (2006-09-01), Biellak et al.
U.S. Appl. No. 60/772,418 entitled Methods and Systems for Determining a Characteristic of a Wafer, filed Feb. 9, 2006.
U.S. Appl. No. 11/110,383 entitled Systems and Methods for Inspecting Specimens Including Specimens That Have a Substantially Rough Uppermost Layer, filed Apr. 20, 2005.

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