Systems and methods for controlling termination resistance...

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Amplitude control

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C326S030000

Reexamination Certificate

active

07439789

ABSTRACT:
Described are controllable termination impedances that may be adjusted collectively by a combination of digital and analog signals. Each adjustable impedance, responsive to the digital signals, establishes a gross termination resistance for one of a plurality of communication channels by enabling one or more of a plurality of parallel-coupled impedance legs. Each leg includes at least one transistor for controlling the impedance of the leg over a continuous range. An analog compensation voltage is level shifted and the resulting level-shifted signal is applied to the control terminals of the transistors of the selected impedance legs. The compensation voltage, and consequently the level-shifted signal, varies with supply-voltage and temperature fluctuations in a manner that causes the collective impedance of the selected legs for each channel to remain stable despite the fluctuations. The combination of digital and analog impedance control provides for coarse impedance adjustments, such as to compensate for process variations, and additionally provides fine, adaptive adjustments to maintain the selected impedance despite changes in the supply voltage and temperature.

REFERENCES:
patent: 4513427 (1985-04-01), Borriello et al.
patent: 5254883 (1993-10-01), Horowitz et al.
patent: 5298800 (1994-03-01), Dunlop et al.
patent: 5396028 (1995-03-01), Tomassetti
patent: 5467455 (1995-11-01), Gay
patent: 5606275 (1997-02-01), Farhang et al.
patent: 5663661 (1997-09-01), Dillon
patent: 5666078 (1997-09-01), Lamphier
patent: 5680060 (1997-10-01), Banniza et al.
patent: 5726582 (1998-03-01), Hedberg
patent: 5793223 (1998-08-01), Frankeny
patent: 5926031 (1999-07-01), Wallace et al.
patent: 5969658 (1999-10-01), Naylor
patent: 5995894 (1999-11-01), Wendte
patent: 6028484 (2000-02-01), Cole et al.
patent: 6052035 (2000-04-01), Nolan et al.
patent: 6060907 (2000-05-01), Vishwanthaiah et al.
patent: 6064224 (2000-05-01), Esch, Jr. et al.
patent: 6084424 (2000-07-01), Gasparik
patent: 6157206 (2000-12-01), Taylor
patent: 6188237 (2001-02-01), Suzuki et al.
patent: 6266001 (2001-07-01), Fang et al.
patent: 6288564 (2001-09-01), Hedberg
patent: 6291881 (2001-09-01), Yang
patent: 6297759 (2001-10-01), Lewyn
patent: 6308232 (2001-10-01), Gasbarro
patent: 6330193 (2001-12-01), Yu et al.
patent: 6344765 (2002-02-01), Taguchi
patent: 6356105 (2002-03-01), Volk
patent: 6356106 (2002-03-01), Greeff
patent: 6356141 (2002-03-01), Yamauchi
patent: 6411122 (2002-06-01), Mughal et al.
patent: 6414512 (2002-07-01), Moyer
patent: 6418500 (2002-07-01), Gai et al.
patent: 6424170 (2002-07-01), Raman et al.
patent: 6442644 (2002-08-01), Gustavson et al.
patent: 6448813 (2002-09-01), Garlepp et al.
patent: 6462591 (2002-10-01), Garrett, Jr. et al.
patent: 6467013 (2002-10-01), Nizar
patent: 6495997 (2002-12-01), Hall et al.
patent: 6509756 (2003-01-01), Yu et al.
patent: 6511901 (2003-01-01), Lam et al.
patent: 6525558 (2003-02-01), Kim et al.
patent: 6530062 (2003-03-01), Liaw et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 6545522 (2003-04-01), Mughal et al.
patent: 6573746 (2003-06-01), Kim et al.
patent: 6573747 (2003-06-01), Radhakrishnan
patent: 6586964 (2003-07-01), Kent et al.
patent: 6597298 (2003-07-01), Kim et al.
patent: 6606004 (2003-08-01), Staszewski et al.
patent: 6608507 (2003-08-01), Garrett, Jr. et al.
patent: 6643787 (2003-11-01), Zerbe et al.
patent: 6661250 (2003-12-01), Kim et al.
patent: 6711073 (2004-03-01), Martin
patent: 6734702 (2004-05-01), Ikeoku et al.
patent: 6756812 (2004-06-01), Nagano et al.
patent: 6762620 (2004-07-01), Jang et al.
patent: 6768352 (2004-07-01), Maher et al.
patent: 6781405 (2004-08-01), Best
patent: 6781416 (2004-08-01), Nguyen et al.
patent: 6806728 (2004-10-01), Nguyen et al.
patent: 6836170 (2004-12-01), Kitagawa et al.
patent: 6856169 (2005-02-01), Frans
patent: 6894691 (2005-05-01), Juenger
patent: 6911875 (2005-06-01), Lee et al.
patent: 6924660 (2005-08-01), Nguyen
patent: 6940303 (2005-09-01), Vargas
patent: 6956413 (2005-10-01), Bailey
patent: 6965529 (2005-11-01), Zumkeher
patent: 6980020 (2005-12-01), Best
patent: 7102200 (2006-09-01), Fan
patent: 7123047 (2006-10-01), Lim
patent: 7148721 (2006-12-01), Park
patent: 2001/0047450 (2001-11-01), Gillingham et al.
patent: 2002/0141896 (2002-10-01), Komazaki et al.
patent: 2004/0124850 (2004-07-01), Koneru
patent: 2004/0201402 (2004-10-01), Rajan
patent: 2005/0041683 (2005-02-01), Kizer
patent: 2005/0052200 (2005-03-01), Nguyen et al.
patent: 2005/0057275 (2005-03-01), Nguyen et al.
patent: 2005/0057278 (2005-03-01), Nguyen et al.
patent: 2006/0007761 (2006-01-01), Ware
patent: 2006/0071683 (2006-04-01), Best
patent: 2006/0077731 (2006-04-01), Ware
patent: 02140676 (1990-05-01), None
patent: WO 97/02658 (1997-01-01), None
patent: WO 98/04041 (1998-01-01), None
patent: WO 00/41300 (2000-07-01), None
patent: WO 00/70474 (2000-11-01), None
patent: WO 2004/061690 (2004-07-01), None
Janzen, Jeff, “DDR2 Offers New Features and Functionality,” Designline, vol. 12, Issue 2, Micron, 16 pages, Jul. 31, 2003 EN.L.
Micron Technical Note, “DDR2-533 Memory Design Guide for Two-DIMM Unbuffered Systems,” TN-47-01, 2003, 19 pages.
DDR2 ODT Control; Product Planning & Application Engineering Team, Dec. 2004, pp. 8.
U.S. Appl. No. 11/018,163, filed Dec. 2004, Nguyen.
U.S. Appl. No. 11/176,876, filed Jul. 2005, Nguyen.
U.S. Appl. No. 11/100,949, filed Apr. 2005, Nguyen.
Gabara, Thaddeus J. et al. “A 200 MHz 100K ECL Output Buffer for CMOS ASICs.” 1990 IEEE. p. 4.
Gabara, Thaddeus J., “On-Chip Terminating Resistors for High Speed ECL-CMOS Interfaces.” Feb. 1992. IEEE. pp. 292-295.
Knight, Thomas F. Jr., “A Self-Terminating Low-Voltage Swing CMOS Output Driver.” IEEE Journal of Solid-State Circuits, vol. 23, No. 2, Apr. 1988. pp. 457-464.
Gabara, Thaddeus J., “Digitally Adjustable Resistors in CMOS for High-Performance Applications.” IEEE Journal of Solid-State Circuits, vol. 27, No. 8, Aug. 1992, pp. 1176-1211.
Babcock, J.A., “Precision Electrical Trimming of Very Low TCR Poly-SiGe Resistors.” IEEE Electron Device Letters, vol. 21, No. 6, Jun. 2000, pp. 283-285.
Shah, Sunay et al., “A Temperature Independent Trimmable Current Source.” Department of Engineering Science, University of Oxford. ISCAS 2002. 4 pages.
Kim, Su-Chul, “Programmable Digital On-Chip Terminator.” ITC-CSCC, 2002. 4 pages.
Johnson, Chris. “The Future of Memory: Grahphics DDR3 SDRAM Functionality.” Micron Designline, vol. 11, Issue 4, 4Q02. 8 pages, 2002.
Al-Sarawi, Said F. et al. “A Review of 3-D Packaging Technology.” IEEE Transactions on Components, Packaging, and Manufacturing Technology-PartB, vol. 21, No. 1, Feb. 1998.
Ko, Hyoung-Soo et al., “Development of 3-Dimensional Memory Die Stack Packages Using Plymer Insulated Sidewall Technique.” IEEE Electronic Components and Technology Conference, 1999.
“400 Mb/s/pin SLDRAM Draft/Advance, 4M×18 SLDRAM-Pipeline, Eight Bank, 2.5V Operation.” Copyright 1998, SLDRAM Inc. 69 pages.
Ware, Frederick A., “Direct RAC Data Sheet” Advance Information. Document DL0064, Version 1.11. Copyright Jul. 2000, Rambus Inc. 66 pages.
“Hastings Rambus Asic Cell Specification Generic Implementation, Revision 0.1 Preliminary.” Copyright 1999 Rambus Inc. Modified Jun. 20, 2003 149 pgs.
Khouri, Gaby, “Evaluation of Alcatel Patent Portfolio by Semiconductor Insights.” Nov. 2004. Copyright Semiconductor Insights Inc. 38 pages.
“Micron Graphics DDR3 DRAM.” Advance. Copyright 2003 Micron Technology, Inc. 67 pages.
Nakase, Yasunobu, et al. “Source-Synchronization and Timing Vernier Techniques for 1.2-GB/s SLDRAM Interface.” IEEE Journal of Solid-State Circuits, vol. 34, No. 4, 1999.
Gillingham, Peter. “SLDRAM Architectural and Functional Overview.” Copyright Aug. 29, 1997 SLDRAM Consortium. 14 pages.
Lluis, Paris. “WP 24.3: An 800MB/s 72Mb SLDRAM with

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Systems and methods for controlling termination resistance... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Systems and methods for controlling termination resistance..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for controlling termination resistance... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4016500

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.