Systems and methods for compressing an encapsulant adjacent...

Details Systems and methods for compressing an encapsulant adjacent... Systems and methods for compressing an encapsulant adjacent...

2007-02-23

2010-11-16

Del Sole, Joseph S (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S272150, C264S279000, C438S127000

Reexamination Certificate

active

07833456

ABSTRACT:
Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece are disclosed. A method in accordance with one aspect includes placing a semiconductor workpiece and an encapsulant in a mold cavity and driving some of the encapsulant from the mold cavity to an overflow chamber. The method can further include applying pressure to the encapsulant in the mold cavity via pressure applied to the encapsulant in the overflow chamber.

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