Systems and methods for charging a cleaning solution used...

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

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C134S036000, C510S175000

Reexamination Certificate

active

07914624

ABSTRACT:
Inventive methods, systems and compositions of cleaning integrated circuit (“IC”) substrates are described. The cleaning methods of the present invention include: charging a solution, which contains at least a solute selected to promote cleaning of the IC substrate, to produce a charged solution, such that at least a portion of the solute is present as clusters in the charged solution; and conveying the charged solution for cleaning the IC substrate.The cleaning systems of the present invention include: a charging chamber for holding a solution, which contains at least a solute selected to promote cleaning of the integrated circuit substrate; and a first acoustic energy source capable of vibrating the solution in the charging chamber to produce a charged solution such that at least a portion of the solute is present as clusters in the charged solution.The cleaning compositions of the present invention include: a solvent; and a solute selected to promote cleaning of the IC substrate, wherein at least a portion of the solute is present in cluster form in the solution and the solute and solvent are present in a volumetric ratio that is between about 3×10−5:1 and about 1×10−24:1.

REFERENCES:
patent: 4837007 (1989-06-01), Duckworth et al.
patent: 5090432 (1992-02-01), Bran
patent: 5476384 (1995-12-01), Giuliani et al.
patent: 5800576 (1998-09-01), Johnson et al.
patent: 5810037 (1998-09-01), Sasaki et al.
patent: 5919311 (1999-07-01), Shive et al.
patent: 5954885 (1999-09-01), Ohmi
patent: 6158075 (2000-12-01), Tanaka et al.
patent: 6378534 (2002-04-01), Olesen et al.
patent: 6450181 (2002-09-01), Morita et al.
patent: 6568408 (2003-05-01), Martens et al.
patent: 6615854 (2003-09-01), Hongo et al.
patent: 6681781 (2004-01-01), Puri et al.
patent: 6800142 (2004-10-01), Tipton et al.
patent: 7007333 (2006-03-01), Mikhaylichenko et al.
patent: 2002/0011253 (2002-01-01), Puri et al.
patent: 2003/0000548 (2003-01-01), Tsuga et al.
patent: 2003/0010356 (2003-01-01), Kuyel
patent: 2003/0045098 (2003-03-01), Verhaverbeke et al.
patent: 2003/0205240 (2003-11-01), Bergman
patent: 2004/0012104 (2004-01-01), Ozawa et al.
patent: 2004/0063074 (2004-04-01), Fisher
patent: 2004/0069330 (2004-04-01), Rolfson
patent: 2004/0130965 (2004-07-01), Achkire et al.
patent: 2004/0151062 (2004-08-01), Yao et al.
patent: 2004/0198190 (2004-10-01), Basol et al.
patent: WO 00/24687 (2000-05-01), None
patent: WO/2006/010052 (2006-01-01), None
Resnick et al., A Study of Cleaning Performance and Mechanisms in Dilute SC-1 Processing, 1995, Materials Research Society, vol. 386, pp. 21-26.
Hall et al., Effect of SC-1 Process Parameters on Particle Removal and Surface Metallic Contamination, 1995, Materials Research Society, vol. 386, pp. 127-133.
Suraj Puri, U.S. Appl. No. 11/944,478, OA mailed Dec. 7, 2009, filed Nov. 23, 2007.
Suraj Puri—U.S. Appl. No. 10/886,785, Notice of Allowance dated Sep. 30, 2009, filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 10/886,785, Allowed claims based on Notice of Allowance dated Sep. 30, 2009, filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 10/886,785, filed, Office Action mailed Jun. 24, 2009, filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 10/886,785, Office Action dated Sep. 25, 2007, filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 10/886,785, Office Action dated Feb. 20, 2009, filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 10/886,785, Office Action dated Nov. 6, 2008, filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 10/886,785, Advisory Office Action dated Sep. 8, 2008, filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 10/886,785, Final Office Action dated Jun. 12, 2008 filed Jul. 7, 2004.
Suraj Puri—U.S. Appl. No. 12/503,302, Office Action mailed Nov. 25, 2009-Jul. 15, 2009.
Suraj Puri—PCT Application No. PCT/US05/36892 Written Opinion, completed Feb. 9, 2007, International filing date Oct. 12, 2005.
Suraj Puri, PCT Application No. PCT/US05/36892 IPER, Apr. 17, 2007, International filing date Oct. 12, 2005.
Suraj Puri—Int'l Search Report and Written Opinion, PCT/US2005/024366, completed Nov. 28, 2005, Int'l filing Jul. 7, 2005.
Suraj Puri—PCT Application No. PCT/US05,024366, IPER Dated Jan. 9, 2007, Int'l filing Jul. 7, 2005.
U.S. Appl. No. 11/093,904, OA Mailing Date: Mar. 4, 2009.
Final Office Action, U.S. Appl. No. 11/093,904, Mailing Date: Nov. 13, 2008.
U.S. Appl. No. 11/944,478, OA mailed Dec. 7, 2009.
Suraj Puri, Final Office Action, U.S. Appl. No. 11/093,904, Mailing Date: Nov. 13, 2008.
Suraj Puri, U.S. Appl. No. 11/944,478, OA mailed Dec. 7, 2009.
Suraj Puri, Office Action, U.S. Appl. No. 11/093,904, OA Mailing Date: Oct. 15, 2008.
Suraj Puri, U.S. Appl. No. 11/093,904, OA Mailing Date: Oct. 7, 2009.
Suraj Puri, U.S. Appl. No. 11/093,904, OA mailed Mar. 11, 2008.
Boericke, William, M.D. Pocket Manual of Homeopathic Materia Medica: The Characteristic and Guiding Symptoms of All Remedies, Jain Publishers, ANAND Offset Press, New Delhi-1 10016, 9thEdl., (1975).
Gray, Bill, M.D., “Homeopathy, Science or Myth: Physics of Potentized Water?”, North Atlantic Books vol. 21, No. 8, pp. 63 and 67, (2005).
Kern, Handbook of Semiconductor Wafer Cleaning Technology, Noyes Publications, pp. 76-81. (1993).
Perry's Chemical Engineers, Handbook, 1997, 7th, Edition, pp. 8-74 through 8-78. (1997).
Kern, Werner, Handbook of Semiconductor Wafer Cleaning Technology, Science Technology and Applications; pp. 18-22; 38-40; 126-127 (1993).

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