Systems and methods for characterizing a polishing process

Details Systems and methods for characterizing a polishing process Systems and methods for characterizing a polishing process

2005-04-26

2005-04-26

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S006000, C451S008000, C451S009000, C451S041000, C451S285000, C451S286000, C451S287000, C451S288000, C438S014000, C438S015000, C438S016000, C438S017000

Reexamination Certificate

active

06884146

ABSTRACT:
Systems and methods for characterizing a polishing process are provided. One method includes scanning a specimen with two or more measurement devices during polishing. In one embodiment, the two or more measurement devices may include a reflectometer and a capacitance probe. In another embodiment, the two or more measurement devices may include an optical device and an eddy current device. An additional embodiment relates to a measurement device for scanning a specimen during polishing. The device includes a light source and a scanning assembly. The scanning assembly is configured to scan light from the light source across the specimen during polishing. Another measurement device includes a laser light source coupled to a first fiber optic bundle and a detector coupled to a second fiber optic bundle. An additional method includes scanning a specimen with different measurement devices during different steps of a polishing process.

REFERENCES:
patent: 4369284 (1983-01-01), Chen
patent: 4618213 (1986-10-01), Chen
patent: 4926489 (1990-05-01), Danielson et al.
patent: 5486701 (1996-01-01), Norton et al.
patent: 5552704 (1996-09-01), Mallory et al.
patent: 5575598 (1996-11-01), Abe et al.
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5747813 (1998-05-01), Norton et al.
patent: 5795688 (1998-08-01), Burdorf et al.
patent: 5872633 (1999-02-01), Holzapfel et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5904609 (1999-05-01), Fukuroda et al.
patent: 5964643 (1999-10-01), Birang et al.
patent: 5970168 (1999-10-01), Montesanto et al.
patent: 5991699 (1999-11-01), Kulkarni et al.
patent: 6012966 (2000-01-01), Ban et al.
patent: 6045433 (2000-04-01), Dvir et al.
patent: 6045439 (2000-04-01), Birang et al.
patent: 6104835 (2000-08-01), Han
patent: 6146259 (2000-11-01), Zuniga et al.
patent: 6159073 (2000-12-01), Wiswesser et al.
patent: 6171181 (2001-01-01), Roberts et al.
patent: 6179709 (2001-01-01), Redeker et al.
patent: 6231434 (2001-05-01), Cook et al.
patent: 6247998 (2001-06-01), Wiswesser et al.
patent: 6254459 (2001-07-01), Bajaj et al.
patent: 6257953 (2001-07-01), Gitis et al.
patent: 6280290 (2001-08-01), Birang et al.
patent: 6282309 (2001-08-01), Emery
patent: 6328872 (2001-12-01), Talich et al.
patent: 6433541 (2002-08-01), Lehman et al.
patent: 6529621 (2003-03-01), Glasser et al.
patent: 6549006 (2003-04-01), Le
patent: 6602724 (2003-08-01), Redeker et al.
patent: 6614520 (2003-09-01), Bareket et al.
patent: 6628397 (2003-09-01), Nikoonahad et al.
patent: 6630995 (2003-10-01), Hunter
patent: 6636301 (2003-10-01), Kvamme et al.
patent: 6671051 (2003-12-01), Nikoonahad et al.
patent: 6673637 (2004-01-01), Wack et al.
patent: 6707540 (2004-03-01), Lehman et al.
patent: 0 628 806 (1994-12-01), None
patent: 1 022 093 (2000-07-01), None
patent: 1 066 925 (2001-01-01), None
patent: 1 081 489 (2001-03-01), None
patent: 1 093 017 (2001-04-01), None
patent: 9922310 (1999-05-01), None
patent: 9923449 (1999-05-01), None
patent: 9925044 (1999-05-01), None
patent: 9945340 (1999-09-01), None
patent: 0000873 (2000-01-01), None
patent: 0000874 (2000-01-01), None
patent: 0018543 (2000-04-01), None
patent: 0026609 (2000-05-01), None
patent: 0026613 (2000-05-01), None
patent: 0036525 (2000-06-01), None
patent: 0068884 (2000-11-01), None
patent: 0070332 (2000-11-01), None
patent: 0140145 (2001-06-01), None
patent: 0180304 (2001-10-01), None

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