Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2011-06-28
2011-06-28
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C257SE21567
Reexamination Certificate
active
07968426
ABSTRACT:
Systems and methods are disclosed for bonding of substrates using microwave energy. In some embodiments, semiconductor substrates can be bonded through a thin interlayer metal to a metal substrate by using microwave energy. High intensity microwave energy is applied to the substrate assembly positioned within a microwave cavity. A process of selective heating can occur in the thin interlayer metal, resulting in melting of the thin interlayer metal to facilitate bonding of the two substrates. Some of the advantages associated with such bonding process are disclosed.
REFERENCES:
patent: 6054693 (2000-04-01), Barmatz et al.
patent: 6103812 (2000-08-01), Wei et al.
patent: 6284085 (2001-09-01), Gwo
patent: 6312548 (2001-11-01), Fathi et al.
patent: 6348679 (2002-02-01), Ryan et al.
patent: 6767749 (2004-07-01), Kub et al.
patent: 6905945 (2005-06-01), Barmatz et al.
patent: 7452800 (2008-11-01), Sosnowchik et al.
patent: 7487849 (2009-02-01), Radtke
patent: 7569800 (2009-08-01), Tian et al.
patent: 2002/0197423 (2002-12-01), Wang et al.
patent: 2004/0009649 (2004-01-01), Kub et al.
patent: 2004/0016752 (2004-01-01), Ratificar et al.
patent: 2004/0024382 (2004-02-01), Cho et al.
patent: 2004/0084444 (2004-05-01), Wang et al.
patent: 2004/0104460 (2004-06-01), Stark
patent: 2004/0183182 (2004-09-01), Swindlehurst et al.
patent: 2005/0003263 (2005-01-01), Mallari et al.
patent: 2005/0178820 (2005-08-01), Morgenstern et al.
patent: 2005/0250232 (2005-11-01), Joodaki
patent: 2005/0252607 (2005-11-01), Kirsten et al.
patent: 2006/0027570 (2006-02-01), Barmatz et al.
patent: 2006/0038189 (2006-02-01), Coffey et al.
patent: 2006/0063351 (2006-03-01), Jain
patent: 2006/0076631 (2006-04-01), Palmateer et al.
patent: 2006/0093840 (2006-05-01), Christoph et al.
patent: 2007/0051774 (2007-03-01), Stipp et al.
patent: 2007/0108195 (2007-05-01), Tian et al.
patent: 2008/0003777 (2008-01-01), Slater et al.
Clendenin, Microwave Bonding of Silicon Dies with Thin Metal Films for MEMS Applications, 2003 Electronic Components and Technology Conference, pp. 18-23.
Jerzy Ruzyllo, Semiconductor Glossary, 2004, pp. 137.
Budraa Nasser K.
Ng Boon
Crawford Latanya
Landau Matthew C
Microwave Bonding Instruments, Inc.
LandOfFree
Systems and methods for bonding semiconductor substrates to... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Systems and methods for bonding semiconductor substrates to..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Systems and methods for bonding semiconductor substrates to... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2714587