Systems and methods for bonding a heat sink to a printed...

Details Systems and methods for bonding a heat sink to a printed... Systems and methods for bonding a heat sink to a printed...

2005-04-12

2005-04-12

Mayes, Melvin C. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Presses or press platen structures, per se

C156S556000, C029S739000, C029S743000

Reexamination Certificate

active

06877542

ABSTRACT:
A bonding system is provided that bonds a heat sink to a printed circuit assembly. The bonding system includes an adhesive applicator that is configured to hold an adhesive layer, and a heat sink holder that is configured to hold a heat sink while the adhesive applicator applies the adhesive layer to the heat sink.

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