Systems and arrangements to assess thermal performance

Details Systems and arrangements to assess thermal performance Systems and arrangements to assess thermal performance

2008-03-04

2008-03-04

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

With measuring or testing

C438S017000

Reexamination Certificate

active

11133427

ABSTRACT:
Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

REFERENCES:
patent: 6873049 (2005-03-01), Shi
patent: 7157320 (2007-01-01), Sasaki
patent: 2004/0023422 (2004-02-01), Miao et al.
patent: 2004/0185612 (2004-09-01), Sasaki

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