Systems and apparatus for flexible thermal management coupling

Details Systems and apparatus for flexible thermal management coupling Systems and apparatus for flexible thermal management coupling

2007-07-17

2007-07-17

Patel, Dhiru R. (Department: 2831)

Electricity: conductors and insulators

With fluids or vacuum

Boxes and housings

C174S050000, C361S600000

Reexamination Certificate

active

11168909

ABSTRACT:
According to some embodiments, systems and apparatus for flexible thermal management coupling are provided. For example, an apparatus or system may includes a conduction component to conduct heat to a thermal management device, a flexible component defining a cavity, wherein the flexible component is to couple the conduction component to an electronic device, and a heat transfer component coupled to transfer heat, via the flexible component, from the electronic device to the conduction component.

REFERENCES:
patent: 5973261 (1999-10-01), Chevallet et al.
patent: 6097596 (2000-08-01), Cipolla et al.
patent: 6723913 (2004-04-01), Barbetta
patent: 2003/0133257 (2003-07-01), Beihoff et al.

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