System to increase throughput in a dual substrate stage...

Photocopying – Projection printing and copying cameras – Step and repeat

Reexamination Certificate

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C355S072000, C355S077000

Reexamination Certificate

active

06965427

ABSTRACT:
A lithography system and method are used to increase throughput using multiple reticles to pattern multiple substrates that are positioned with respect to one another according to a predetermined sequence. For example, during a first exposure period a first reticle patterns a first set of substrates, during a second exposure period a second reticle patterns a second set of substrates, during a third exposure period the first reticle patterns a third set of substrates, etc., until all desired substrates are patterned. It is to be appreciate that after the first and second reticles are complete, third and fourth reticles can pattern the first, second, third, etc. sets of substrates.

REFERENCES:
patent: 5677758 (1997-10-01), McEachern et al.
patent: 5897986 (1999-04-01), Dunn et al.
patent: 6134008 (2000-10-01), Nakao
patent: 6590634 (2003-07-01), Nishi et al.
patent: 6628372 (2003-09-01), McCullough et al.

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