Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1998-07-28
2001-10-16
Gandhi, Jayprakash N. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S772000, C361S803000, C174S050510, C439S733100, C029S842000
Reexamination Certificate
active
06304455
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to an arrangement for electrical and/or electronic components, in particular for use in an electronic controller, and to a method for manufacturing such an arrangement.
BACKGROUND INFORMATION
German Patent Application No. 42 40 755 describes a conventional arrangement which is particularly used in electronic controllers. The arrangement includes a supporting plate having a printed circuit board substrate applied thereto, which is provided with an electronic circuit and components, and a plug-in part, joined to the support plate, having a plurality of connector pins embedded in an insulating material and leading out of the plug-in part on both sides. The arrangement is connected, e.g., in a motor vehicle, to external plug-in connectors, which can be attached to the first ends of the connector pins. The second ends, facing the printed circuit board, of the connector pins run parallel to the printed circuit board and have end faces aligned perpendicular to the printed circuit board; they are also connected, via bonding wires, to connecting surfaces on the printed circuit board at the stamped-out lateral surfaces. In this context, it is disadvantageous that, with such an arrangement, the space over the lateral surfaces of the connector pins must be kept free, the surfaces being aligned parallel to the printed circuit board substrate and to the support plate, so that, in creating the bonding connections, the bonding tool can be placed onto the connector pins. An arrangement of the connector pins in a plurality of rows is therefore not possible, which, particularly in the case of plug-in parts having very many pins, leads to having to enlarge the plug connector laterally, as a result of which the spatial dimensions of the plug-in part increase disadvantageously and the space requirements become considerable. On the basis of the large distances to the connector pins, which are located further to the outside, it is only heavy-gauge-wire bonding connections having a wire diameter of 0.1 to 0.3 mm that are bonded onto the stamped-out lateral surfaces of the connector pins. In this context, it is disadvantageous that the creation of heavy-gauge-wire bonding connections requires a great deal more time than the creation of small-gauge-wire bonding connections. Furthermore, it is known, in the case, for example, of hybrid circuits, to provide the end faces of connector pins with offsets or plateaus, in order to be able to bond directly onto the plateaus of the connector pins. In this context, it is disadvantageous that an additional cumbersome manufacturing step is required, and that the plug-in part is enlarged overall due to the spatial dimensions of the offsets.
SUMMARY OF THE INVENTION
An arrangement according to the present invention has an advantage that space requirements for connecting the substrate to the connector pins and the width of the plug-in part can be significantly reduced in a simple manner. This is achieved in that the bonding wire is bonded directly onto the stamped-out connecting pin end faces running parallel to the substrate on the supporting plate. The intervals between the connector pins, manufactured as finely precision stamped parts, can be advantageously selected so as to be so small that the dimensions of the raster of the connector pins correspond to the dimensions of the raster of the connecting surfaces on the substrate. In addition, the interval between the connector pins and the connecting surfaces of the substrate can be advantageously reduced, along with the size of the substrate. In this way, a smaller, more compact design of the arrangement is realized overall.
It is particularly advantageous to arrange the connector pins in a plurality of parallel rows in the plug-in part, since all the end faces of the connector pins are freely accessible and the bonding tool, during the creation of the bonding wire connections, can be placed onto the end faces from the side of the supporting plate which is facing the substrate. By arranging the connector pins in a plurality of parallel rows, it is advantageously achieved that the width of the raster of the end faces is not larger than the width of the raster of the connecting surfaces on the substrate, even when the end surfaces are somewhat wider than the connecting surfaces.
Additionally, it is advantageous to coat at least the stamped edge of the connector pins with a metal plating which is applied through electroplating, in order to increase the quality of the welded connection between the bonding wire and the connecting pin.
It is furthermore advantageous for the production of the plug-in part if the second ends of the connector pins protrude a bit from the plug-in part, which is manufactured as an injection-molded part, since then the connector pins, during the injection molding of the plug-in part, can be maintained in adjustment with great precision within the insertion molding die.
It is also advantageous to mount the plug-in part within the cavity of the supporting plate, since in this way the connector pins can be positioned close to the connecting surfaces of the substrate in a particularly simple manner.
Also advantageous is a method for manufacturing an arrangement having a supporting plate and at least one substrate, applied thereon, for electrical and/or electronic components, and having a plug-in part which has, embedded in an insulating material, a plurality of connector pins whose first ends are provided for the connection to external plug-in devices and whose second ends are electrically connected to the substrate via bonding wires, the method including the following steps: free-stamping the connector pins from a metal band retaining a one-sided crosspiece joining the connector pins at their first ends; precision stamping the connector pins; electroplating the connector pins with a contact metal plating; removing the crosspiece; inserting the connector pins into an injection molding die and manufacturing the plug-in part by injection molding using an insulating material; inserting the plug-in part into a cavity of the supporting plate, the plug-in part having connecting pin end faces that run roughly parallel to the substrate; and creating the bonding wire connections between the end faces of the individual connector pins and the substrate on the supporting plate.
Producing the connector pins as simple stamped-out parts is particularly cost-effective. By precision stamping the connector pins, it is advantageously achieved that the connecting pin end faces have the surface quality that is required for wire bonding. The connector pins, in this context, are advantageously maintained via a one-sided connecting piece, which is removed only after the subsequent electroplating coating of the connector pins.
It is particularly advantageous to use small-gauge-wire bonding connections having a wire-diameter of 0.025 to 0.1 mm, whose manufacture, in comparison with the conventional heavy-gauge-wire bonding connections in the Prior Art, can be carried out very much more rapidly.
REFERENCES:
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patent: 5263880 (1993-11-01), Schwarz et al.
patent: 5359761 (1994-11-01), Whitson et al.
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patent: 5530287 (1996-06-01), Currie et al.
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patent: 5668698 (1997-09-01), Jozwiak et al.
patent: 5774342 (1998-06-01), Brandenburg et al.
patent: 637 248 (1983-07-01), None
patent: 41 42 138 (1993-04-01), None
patent: 42 40 755 (1994-06-01), None
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Huber Elmar
Litzinger Rolf
Raica Thomas
Gandhi Jayprakash N.
Kenyon & Kenyon
Robert & Bosch GmbH
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