System on package of a mobile RFID interrogator

Details System on package of a mobile RFID interrogator System on package of a mobile RFID interrogator

2011-06-21

2011-06-21

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S678000, C257S692000, C257S728000, C257SE23001, C257SE23010, C343S872000, C343S873000, C455S280000

Reexamination Certificate

active

07964944

ABSTRACT:
The present invention is to implement a SOP of a mobile RFID interrogator. The substrate has external connection terminal patterns on a first surface of a substrate and circuit wiring patterns on a second surface of the substrate. a high frequency front-end part, a power amplifier IC, an analog-digital signal processing chip and the like are mounted on the second surface. The high frequency front-end part is to transmit and receive a RFID signal. The power amplifier IC is to output an amplified high frequency transmission signal to the high frequency front-end part. The analog-digital signal processing chip is to output a high frequency transmission signal to the power amplifier IC and process the RFID signal received through the high frequency front-end part, a mold resin is to cover the second surface and components mounted on the second surface for electrical insulation from outside and physical protection from outside.

REFERENCES:
patent: 6977428 (2005-12-01), Nakamura
patent: 7035081 (2006-04-01), Nagata et al.
patent: 2004/0169198 (2004-09-01), Nagata et al.
patent: 2006/0033664 (2006-02-01), Soler Castany et al.

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