System of electronic laminates with improved registration proper

Details System of electronic laminates with improved registration proper System of electronic laminates with improved registration proper

1992-11-30

1994-09-27

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428457, 361750, B32B 300, B32B 700

Patent

active

053506219

ABSTRACT:
Dimensionally stable laminates of epoxy resin reinforced with glass fibers have a coefficient of thermal expansion which matches that of copper, making possible copper foil covered laminates which provide improved registration in multilayer printed circuit boards. New glass fabric styles provide balanced thermal expansion in both the warp and fill directions.

REFERENCES:
patent: 5041699 (1991-08-01), Soliday
Coombs, "Printed Circuits Handbook", McGraw Hill, 1989 pp. 34.1-34.5.
Coombs "Printed Circuits Handbook", McGraw Hill, 1988, pp. 3.22-3.23, 6.1-6.3, 7.1-7.7, 31.6-31.9, 32.1-32.4.
Lo, S. Y. and H. T. Hahn, "Hygrothermal Expansion of Kevlar 49/Epoxy and S.sub.2 -Glass/Epoxy Composites," Trans. Systs. Res. Rpt. UCRL15517, S/C 6641009, Nov. 1982, pp. 1-22.

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