System of electronic laminates with improved registration proper

Coating processes – With post-treatment of coating or coating material – Heating or drying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4273897, 4273899, 4274073, C03C 2502

Patent

active

054646588

ABSTRACT:
Dimensionally stable laminates of epoxy resin reinforced with glass fibers have a coefficient of thermal expansion which matches that of copper, making possible copper foil covered laminates which provide improved registration in multilayer printed circuit boards. New glass fabric styles provide balanced thermal expansion in both the warp and fill directions.

REFERENCES:
patent: 4414264 (1983-11-01), Olson

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System of electronic laminates with improved registration proper does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System of electronic laminates with improved registration proper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System of electronic laminates with improved registration proper will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-195975

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.