Plastic article or earthenware shaping or treating: apparatus – Preform reshaping or resizing means: or vulcanizing means... – Surface deformation means only
Reexamination Certificate
2007-01-30
2007-01-30
Del Sole, Joseph S. (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Preform reshaping or resizing means: or vulcanizing means...
Surface deformation means only
C425S406000
Reexamination Certificate
active
10787476
ABSTRACT:
UV molding from elastomeric masters on thin bendable backplanes that allow replication of UV-cured resist patterns with high accuracy is disclosed. This design accommodates large substrate topographies, has improved de-molding properties, and facilitates two-in-one lithography and assembly of the sliders on topographically structured elastomeric sticky pads. The combination of sticky pad assembly and two-in-one lithography allows an all-in-one harmony process based on UV-molding. These features cure prior art technical problems of the harmony process while significantly reducing cost.
REFERENCES:
patent: 654867 (1900-07-01), Baker
patent: 4564585 (1986-01-01), Blaske et al.
patent: 5548886 (1996-08-01), Kojima et al.
patent: 5567333 (1996-10-01), Hira et al.
patent: 5768055 (1998-06-01), Tian et al.
patent: 5817242 (1998-10-01), Biebuyck et al.
patent: 5853959 (1998-12-01), Brand et al.
patent: 5895582 (1999-04-01), Wilson et al.
patent: 6004472 (1999-12-01), Dorius et al.
patent: 6061897 (2000-05-01), Shouji et al.
patent: 6088908 (2000-07-01), Imamura et al.
patent: 6309580 (2001-10-01), Chou
patent: 6503406 (2003-01-01), Hsiao et al.
patent: 2002/0008078 (2002-01-01), Hatamura et al.
patent: 2002/0089787 (2002-07-01), Lu et al.
patent: 1 072 954 (2001-01-01), None
patent: 10064213 (1998-03-01), None
patent: 10289424 (1998-10-01), None
patent: 11061447 (1999-03-01), None
patent: 2001006142 (2001-01-01), None
patent: 2001035112 (2001-02-01), None
Bietsch et al, Conformal contact and pattern stability of stamps used for soft lithography, Oct. 1, 2000, Journal of Applied Physics, vol. 88, No. 7, pp. 4310-4318.
Michel et al, Printing meets lithography: Soft approaches to high-resolution patterning, IBM Journal of reseach and development, Advanced Semiconductor Lithography, vol. 45, No. 5, 2001.
IBM Technical Disclosure Bulletin;Patterned Substrate for Improved Slider Fabrication; Oct. 1993, pp. 409-410.
Bietsch Alexander
Chaw Michael W.
Lahiri Ashok
McFadyen Ian Robson
Michel Bruno
Bracewell & Giuliani LLP
Del Sole Joseph S.
Hitachi Global Storage Technologies Netherlands BV
Luk Emmanuel S.
LandOfFree
System, method, and apparatus for multilevel UV molding... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with System, method, and apparatus for multilevel UV molding..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System, method, and apparatus for multilevel UV molding... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3811546