Optical waveguides – Integrated optical circuit
Reexamination Certificate
2006-09-21
2008-11-25
Nguyen, Dao H (Department: 2818)
Optical waveguides
Integrated optical circuit
C385S042000, C385S044000, C385S049000, C385S050000, C385S088000, C438S027000, C438S029000, C438S041000, C257S722000, C257S726000, C257S728000, C257SE23010, C257SE23101
Reexamination Certificate
active
07457491
ABSTRACT:
The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122or124) of a layer (114, 116or118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.
REFERENCES:
patent: 4732446 (1988-03-01), Gipson et al.
patent: 4772787 (1988-09-01), Trommer
patent: 4966430 (1990-10-01), Weidel
patent: 5170448 (1992-12-01), Ackley et al.
patent: 5357122 (1994-10-01), Okubora et al.
patent: 5400419 (1995-03-01), Heinen
patent: 5654228 (1997-08-01), Shieh et al.
patent: 6097748 (2000-08-01), Huang et al.
patent: 6243509 (2001-06-01), Chen
patent: 6696755 (2004-02-01), Kami et al.
patent: 6785447 (2004-08-01), Yoshimura et al.
patent: 6845184 (2005-01-01), Yoshimura et al.
patent: 2002/0191656 (2002-12-01), Mawst et al.
patent: 2003/0223697 (2003-12-01), Simon
patent: 2004/0037512 (2004-02-01), Cho et al.
patent: 2004/0202210 (2004-10-01), Thornton
patent: 2004/0202218 (2004-10-01), Thornton
Ray T. Chen, Lei Lin, Chulchae Choi, Yujie J. Liu, Bipin Bihari, L. Wu, Suning Tang, R. Wickman, B. Picor, M. K. Hibbs-Brenner. J. Bristow and Y. S. Liu, “Fully Embedded Board Level Guided Wave Optoelectronic Interconnects”, Jun. 2002, Proc. of the IEEE, vol. 88, No. 6, pp. 780-793.
Chulchae Choi, Lei Lin, Yujie Liu and Ray T. Chen, “Performance Analysis of 10-μm- Thick VCSEL Array in Fully Embedded Board Level Guided-Wave Optoelectronic Interconnects”, Oct. 2002, IEEE pp. 1531-1535.
H. Fathollahnejad, D. L. Mathine, R. Droopad, G. N. Maracas, and S. Daryanani, “Vertical-cavity surface emitting lasers integrated onto silicon substrates by PdGe contacts”, Jul. 1994, Electron. Lett., vol. 30 No. 15.
Detlef Krabe, Frank Ebling, Norbert Amdt-Staufenbiel, Günter Lang and Wolfgang Scheel, “Electrical/Optical Circuit Board Built for SMT Manufacturing”, Electronic Packaging and Production, pp. 38-47. Jul. 2000.
Yung-Cheng Lee, Stanley E. Swirhun, Winston S. Fu, Tim A. Keyser, Jaack L. Jewell, and William E. Quinn, “Thermal management of VCSEL-Based Optoelectronic Modules”, Aug. 1999, IEEE Trans. On Comp, Packaging and Manufacturing Technol. vol. 19(3), pp. 540-547.
Chao-Kun Lin, Sang-Wan Ryu, and P. Daniel Dapkus, “High Performance Wafer-Bonded Bottom-Emitting 850nm VCSEL's on Undoped GaP and Saphire Substrates”, Dec. 1999, IEEE Photon. Technol. Lett., vol. 11, No. 12.
B. Lunitz, J. Guttmann, H. P. Huber, J. Moisel and M. Rode, “Experimental Demonstration of 2.5GBit/s transmission with 1m polymer optical backplane”, 2001, Electron. Lett., vol. 37, No. 17.
F. Mederer, R. Jäger, H. J. Unold, R. Michalzik, K. J. Ebeling, S. Lehmacher, A. Neyer, and E. Griese, “3-Gb/s Data Transmission With GaAs VCSEL's Over PCB Integrated Polymer Waveguides”, IEEE Photon. Technol. Lett. 2001, vol. 13, No. 9. Sep.
J. Piprek, T. Tröger, B. Schröter, J. Kolodzey and C. S. Ih, “Thermal Conductivity Reduction in GaAs-AlAs Distributed Bragg Reflectors”, Jan. 1998, IEEE Photon. Technol. Lett., vol. 10, No. 1.
Rui Pu, Carl W. Wilmsen, Kent M. Geib, and Kent D. Choquette, “Thermal Resistance of VCSEL's Bonded to Integrated Circuits”, IEEE Photon. 1999, Technol. Lett., vol. 11, No. 12, pp. 1554-1556.
T. Yao, “Thermal Properties of AlaS/gaAs superlattices”, 1987, Appl. Phys. Lett., vol. 51, pp. 1798-1800.
Chen Ray T.
Chol Chulchae
Board of Regents , The University of Texas System
Chalker Daniel J.
Chalker Flores LLP
Flores Edwin
Nguyen Dao H
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