System-in-package type semiconductor device

Details System-in-package type semiconductor device System-in-package type semiconductor device

2007-12-25

2007-12-25

Soward, Ida M. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S685000, C257S723000, C257S777000, C361S056000, C361S091100, C361S111000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000, C716S030000

Reexamination Certificate

active

11244877

ABSTRACT:
A system-in-package type semiconductor device includes a plurality of semiconductor chips, a first semiconductor chip1110to which electric power is supplied from first power supply wiring1111, and first ground wiring1112to which the first circuit unit is coupled. Moreover, the system-in-package type semiconductor device includes a second semiconductor chip1120to which electric power is supplied from second power supply wiring1124, and second ground wiring1125coupled to the second circuit unit. The first semiconductor chip includes a first interface circuit unit1412, and the second circuit unit includes a second interface circuit unit1121configured to perform inputting or outputting of a signal to and from the first interface circuit unit. The first ground wiring1414is coupled to the second ground wiring1424through a protection circuit1442, and the second interface circuit unit is placed in the vicinity of the first interface circuit unit.

REFERENCES:
patent: 5886558 (1999-03-01), Iijima et al.
patent: 2002/0105062 (2002-08-01), Kikuchi et al.
patent: 2003/0141926 (2003-07-01), Mizuno et al.
patent: 2005/0029648 (2005-02-01), Suwa et al.
patent: 2006/0176101 (2006-08-01), Mizuno et al.

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