System in package (SIP) integrated circuit and packaging...

Details System in package (SIP) integrated circuit and packaging... System in package (SIP) integrated circuit and packaging...

2006-09-18

2009-11-10

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S106000, C438S127000

Reexamination Certificate

active

07615412

ABSTRACT:
The present invention discloses a system in package (SIP) integrated circuit and a packaging method thereof. The SIP integrated circuit includes one or more first block dices produced by a first process and one or more second block dices produced by a second process. The first block dices are electrically connected to the second block dices. The first block dices and the second block dices are packaged into a system.

REFERENCES:
patent: 6504398 (2003-01-01), Lien et al.
patent: 6569714 (2003-05-01), Becker
patent: 6768186 (2004-07-01), Letterman, Jr. et al.
patent: 7006370 (2006-02-01), Ramesh et al.
patent: 7342310 (2008-03-01), Kelly et al.
patent: 521415 (2003-03-01), None
patent: 1230992 (2005-04-01), None
patent: 1243471 (2005-11-01), None
Chinese Taiwan Examination Report of Taiwan Patent Application No. 095125797, dated Jun. 15, 2009.

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