System having integrated circuit package with lead frame having

Details System having integrated circuit package with lead frame having System having integrated circuit package with lead frame having

1995-12-29

1998-10-06

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257692, H01L 23495

Patent

active

058181024

ABSTRACT:
An electronic system utilizing at least one integrated circuit including a semiconductor integrated circuit chip housed in a package providing external electrical connections for the circuit chip. The system package has only a limited number of external connections available for such use. The system package includes an internal buss, or plurality of busses, which are electrically connected to the circuit chip and to selected external connections or the package to improve the efficiency of utilization of external connections on the package, as well as improving operating characteristics of the integrated circuit chip by improvements to voltage and current distributions to the chip, and also eliminating in some cases the consequences of a poor quality of external electrical connection to the system package itself.

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