System for using digital signal processing to compensate for...

Electrical audio signal processing systems and devices – Audio transducer protection circuitry

Reexamination Certificate

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C381S056000, C381S059000, C381S397000, C381S096000, C381S116000, C381S058000

Reexamination Certificate

active

07447318

ABSTRACT:
This invention provides a compensation system capable of compensating for power loss due to the power compression effects of the voice coil as the temperature of the voice coil increases. To compensate for the power compression effect, the invention predicts or estimates the temperature of the voice coil using a thermal-model, and adjusts the estimated temperature according to the cooling effect as the voice coil moves back and forth in the air gap. The thermal-model may be an equivalent electrical circuit that models the thermal circuit of a loudspeaker. With the input signal equating to the voltage delivered to the loudspeaker, the thermal-model estimates a temperature of the voice coil. The estimated temperature is then used to modify equalization parameters. To account for the cooling effect of the moving voice coil, the thermal resistance values may be modified dynamically, but since this cooling effect changes with frequency, a cooling equalization filter may be used to spectrally shape the cooling signal, whose RMS level may be used to modify the thermal resistance values. The invention may include a thermal limiter that determines whether the estimated voice coil temperature is below a predetermined maximum temperature to prevent overheating and possible destruction of the voice coil.

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Hsu, T.S. Temperature prediction of the voice coil of a moving coil loudspeaker by computer simulation. Mar. 2000 Journal of Acoustics Society. All pages.
Hsu, T.S. , et al. Temperature prediction of the voice coil of a moving coil loudspeaker by computer simulation. Journal of Acoutical Society of Japan, vol. 21, pp. 57-62, Mar. 2000.
Hsu, T.S, et al. Temperature prediction of the voice coil of a moving coil loudspeaker by computer simulation. Journal of Acoustical Society of Japan, vol. 21, pp. 57-62, Mar. 2000.
Peter Chapman. Thermal Protection of a loudspeaker. Presented at the 108th Audio Engineering Society (AES) Convention. Feb. 2000.
Hsu, T.S. et al. Temperature prediction of the voice coil of a moving coil loudspeaker by computer simulation. Journal of Acoustical Society of Japan, vol. 21, pp. 57-62, Mar. 2000.
Hsu, T.S. et al. Temperature prediction of hte voice coil of a moving coil loudspeaker by computer simulation. Journal of Acoustical Society of Japan, vol. 21, pp. 57-62, Mar. 2000.
Hsu T. S., et al.:Journal of the Acoustical Society of Japan, vol. 21, No. 2, pp. 57-62, Mar. 2000; “Temperature Prediction of the Voice Coil of a Moving Coil Loudspeaker by Computer Simulation”.
Gander, M. R.,Journal of the Audio Engineering Society, vol. 34, No. 9, pp. 627-646, Sep. 1986; “Dynamic Linearity and Power Compression in Moving-Coil Loudspeakers”.
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“An Electronic Loudspeaker/Enhancement and Protection Device”, Paper 6-030, The AES 6thInternational Conference: Sound Reinforcement; Apr. 1988.

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