System for ultraviolet atmospheric seed layer remediation

Details System for ultraviolet atmospheric seed layer remediation System for ultraviolet atmospheric seed layer remediation

2006-03-21

2006-03-21

Nhu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S678000

Reexamination Certificate

active

07015568

ABSTRACT:
The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

REFERENCES:
patent: 4255383 (1981-03-01), Schenck
patent: 4317041 (1982-02-01), Schenck
patent: 4723420 (1988-02-01), Sitte
patent: 6099735 (2000-08-01), Kelada
patent: 6254689 (2001-07-01), Meder
patent: 6555835 (2003-04-01), Wydeven
patent: 0661110 (1995-07-01), None
patent: 06083379 (1994-08-01), None

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