System for thin film deposition utilizing compensating forces

Details System for thin film deposition utilizing compensating forces System for thin film deposition utilizing compensating forces

2009-05-13

2010-12-14

Garber, Charles D (Department: 2812)

Coating apparatus

Gas or vapor deposition

C118S728000, C118S729000

Reexamination Certificate

active

07850780

ABSTRACT:
A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed.

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U.S. Appl. No. 11/620,744, filed Jan. 8, 2007, Levy.

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