System for testing semiconductor die on multiple...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S760020, C438S017000

Reexamination Certificate

active

06927593

ABSTRACT:
A system for testing semiconductor die on multiple semiconductor wafers includes a testing unit (82), a test fixture bank (84) operably coupled to the testing unit (82), a plurality of test fixture racks (86-92) operably coupled to the test fixture bank (84) and a plurality of wafer-interposer assemblies (94-140) operably coupled to each of the test fixture racks (86-92). Each of the wafer-interposer assemblies (94-140) includes a semiconductor wafer having a plurality of semiconductor die and an interposer coupled to the semiconductor wafer. The interposer has a first set of conductors for electrically connecting the semiconductor die of the semiconductor wafer to a substrate and a second set of conductors that electrically connect the semiconductor die of the semiconductor wafer to the test fixture rack (86-92) via a connector, thereby providing for addressing and testing of the semiconductor die.

REFERENCES:
patent: 5600257 (1997-02-01), Leas et al.
patent: 5707881 (1998-01-01), Lum
patent: 6094060 (2000-07-01), Frankeny et al.

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