Heat exchange – Structural installation – Related to wall – floor or ceiling structure of a chamber
Patent
1984-07-10
1987-03-03
Bennett, Henry
Heat exchange
Structural installation
Related to wall, floor or ceiling structure of a chamber
237 69, F24H 906, F24D 300, F24D 500
Patent
active
046468145
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The invention relates to a system for tempering a room which is installed in a closure of the room, preferably in the floor, where on the side of the closure looking away from said room an inner layer, especially an insulating plate, which possibly has projections to be arranged in the direction of the room, is foreseen, on which a wall of floor covering is foreseen on the side facing the room, and where in the interspace between the inner layer and the outer layer, possibly between the projections, air can be circulated and a heating and/or cooling line extends, said line being at least partially connected with a thermal conductive sheet.
It is noted here fundamentally that the invention relates to the heating, as well as to the cooling of a room, and that it can be installed not only in the floor, but also in one or more of the walls or in the ceiling.
BACKGROUND OF THE INVENTION
Previously, the recesses for accommodating the line foreseen between the projections were constructed withsuch a height that air could be circulated over or under the line. This required on the one hand holding devices of special construction for the line, and on the other hand the height of the tempering system between the inner layer and the outer layer usually had to be twice as long as the diameter of the line.
In addition, it was previously assumed that the essential task of a thermal conductive sheet is to transport the heat or the cold from the line to the surface of the construction, and to immediately distribute it over a larger surface. In the scope of the present invention it was established that in the performance of this task only a modest portion of the heat can be transported, namely by conduction, so that the temperature difference between the line and the surface of the closure is to be sure reduced, but that it is still too high. This leads to heat accumulation, and hence to the necessity of operating with, e.g. in the case of warm-water floor heating, a higher supply temperature. This circumstance reduces the economy of the heating system to a state which is lower than if the supply temperature could be lowered further.
SUMMARY OF THE INVENTION
It is the objective of the invention to improve a tempering system of the aforementioned type with regard to its economy, and to decrease the possible heat losses by improving the distribution and utilization of the heat such that the supply temperature can possibly be lowered.
According to a further objective a further improvement is to be achieved on the one hand by avoiding heat energy losses in the direction leading away from the room and by good aerodynamic direction of the aforementioned air flow into the room, and on the other hand by reducing the structural height, by which measure for the one part the heat transfer routes are shortened, and for the other part installation is afforded where it has previously been impossible due to the restricted spatial conditions.
According to the present invention this objective is reached by the distance between the inner layer and the outer layer preferably being essentially equal to or only slightly deviating from the height of the line measured in the direction of the wall thickness, and by the total surface of the thermal conductive sheet being about twice as large as the surface of the thermal conductive sheet directly enveloping the line being exposed to the air blow.
Surprisingly, by these measures a synergetic effect is achieved: For the one part the structural height of the tempering system can be kept to a minimum; for the other part either no or very much simpler holding devices are also necessary for the line. However, by the low structural height the problem is encountered that the air can no longer pass over or underneath the line, but that it must pass around the line, whereby the heat transfer (which is also favored by the low structural height), is also impeded, for which reason according to the further characteristics of the invetion an, "underfloor convector" is created, the gi
REFERENCES:
patent: 2226061 (1940-12-01), Kershaw
patent: 4109859 (1978-08-01), Durst
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