System for soldering a semiconductor laser to a metal base

Details System for soldering a semiconductor laser to a metal base System for soldering a semiconductor laser to a metal base

1979-07-19

1982-03-23

McQuade, John

Metal fusion bonding

Process

Critical work component, temperature, or pressure

357 67, 228123, 228124, H01L 2160

Patent

active

043216170

ABSTRACT:
A GaAs diode and a copper base are joined together so as to form a soldered system comprising an indium layer inserted between two tungsten layers which serve as a barrier for preventing indium diffusion. A thin gold or platinum wetting layer is applied to the tungsten layers to aid in adherence of the solder to the tungsten without the impairment of the indium during soldering operations due to alloying. The invention is applicable to optical-fiber telecommunication systems.

REFERENCES:
patent: 3396454 (1968-08-01), Murdock et al.
patent: 3609471 (1971-09-01), Scace et al.
patent: 3798746 (1974-03-01), Alphonse et al.
patent: 3883946 (1975-05-01), Dale
patent: 4064621 (1977-12-01), Lo
patent: 4179533 (1979-12-01), Christou et al.
Manko Solders and Soldering, McGraw-Hill, Inc., New York, N.Y., 1964, pp. 104-105.

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