System for solder ball inner stacking module connection

Details System for solder ball inner stacking module connection System for solder ball inner stacking module connection

2008-03-11

2011-11-29

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S777000, C257SE23024, C257SE21502, C438S109000

Reexamination Certificate

active

08067828

ABSTRACT:
An integrated circuit package-in-package system including: providing a substrate; mounting a structure over the substrate; supporting an inner stacking module cantilevered over the substrate by an electrical interconnect connected to the substrate, the electrical interconnect forming a gap between the inner stacking module and the structure controlled by the size of the electrical interconnect; and encapsulating the structure and inner stacking module with an encapsulation.

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