System for slicing silicon wafers

Details System for slicing silicon wafers System for slicing silicon wafers

1978-10-16

1980-03-04

Whitehead, Harold D.

Stone working

Sawing

Endless

83820, B28D 108

Patent

active

041911598

ABSTRACT:
An improved system having at least one endless band saw blade characterized by a continuously regenerated cutting edge and unidirectionally driven along a pair of courses extended in mutual parallelism through a cutting station located near the midportion of said courses. The blade is supported at the cutting station by pairs of guides continuously rotated through less than 360.degree. of angular displacement during each cutting operation for thus continuously regenerating the blade-supporting surfaces of the guide whereby blade wobble substantially is eliminated.

REFERENCES:
patent: 1662488 (1928-03-01), Burkhardt
patent: 2369068 (1945-02-01), Mentzer
patent: 2831476 (1958-04-01), Wilson
patent: 2896605 (1959-07-01), Thompson
patent: 3145604 (1964-08-01), Foley
patent: 3461764 (1969-08-01), Benith

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