System for separating a semiconductor wafer with discrete pellet

Details System for separating a semiconductor wafer with discrete pellet System for separating a semiconductor wafer with discrete pellet

1975-03-27

1979-02-20

Simpson, Othell M.

Severing by tearing or breaking

Breaking or tearing apparatus

Including means to apply thermal shock to work

225103, B26F 300

Patent

active

041402600

ABSTRACT:
This invention relates to a system for separating a semiconductor wafer into a plurality of discrete pellets while maintaining the relative orientation that the pellets exhibited when in the wafer. The invention is carried out by first applying a ductile variable coupling layer to a surface of the wafer. The coupling layer is affixed to a stretchable membrane which, after the wafer is subdivided, is stretched to space the pellets from one another. The coupling material adheres more tightly to the membrane than to the wafer. A portion of the bond between the ductile coupling layer and the membrane is broken during stretch so that the pellets adhere less tightly to the coupling layer following stretch than prior thereto.

REFERENCES:
patent: 3040489 (1962-06-01), Costa
patent: 3206088 (1965-09-01), Meyer et al.
patent: 3396452 (1968-08-01), Sato et al.
patent: 3461537 (1969-08-01), Lotz
patent: 3497948 (1970-03-01), Wiesler et al.
patent: 3537169 (1970-11-01), Eigman
patent: 3562057 (1971-02-01), McAlister et al.
patent: 3714704 (1973-02-01), Moore
patent: 3727282 (1973-04-01), Neary
patent: 3870196 (1975-03-01), Hargraves

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