System for sensing and forming objects such as leads of electron

Details System for sensing and forming objects such as leads of electron System for sensing and forming objects such as leads of electron

1986-02-21

1987-11-10

Larson, Lowell A.

Wireworking

Wire straightening

29741, 29837, 901 47, 72 30, H05K 330

Patent

active

047050810

ABSTRACT:
An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.

REFERENCES:
patent: 4573254 (1986-03-01), Kirk et al.
patent: 4598456 (1986-07-01), McConnell
patent: 4654964 (1987-04-01), Schneider et al.
Chisholm et al, "Mass Pin Straightening for Circuit-Pack Backplanes", Western Electric Engineer, vol. 24, No. 8, Fall 1980, pp. 35 to 40, 140/147.
Di Lorenzo et al, "Component Position Recognition and Device for an Assembly Robot", IBM Technical Disclosure Bulletin, vol. 26, No. 7B, Dec. 1983, pp. 3664 to 3666.
Asano et al., "Vision System Aligns Leads for Automatic Component Insertion", Assembly Automation, Feb. 1983, pp. 32-35.
Klass, "Circuit Board Assembly Plant to Test Systems", Aviation Week & Space Technology, Aug. 2, 1982, pp. 66-68.
Sanderson and Perry, "Sensor-Based Robotic Assembly Systems: Research and Applications in Electronic Manufacturing", Proceedings of the IEEE, vol. 71, No. 7, Jul. 1983, pp. 856-871.
Murai et al., "Automatic Insertion of Electronic Components by Optical Detection of Lead Positions", Fourth International Conference on Assembly Automation, pp. 390-399, date unknown.
Asano et al., "Vision System of an Automatic Inserter for Printed Circuit Board Assembly", publication and date unknown.
Sanderson and Perry, "Sensor-Based Robotic Assembly Systems: Research and Applications in Electronic Manufacturing", Draft Manuscipt, Nov. 10, 1982.

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