Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Patent
1997-05-14
1999-05-11
Ryan, Patrick
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
228 52, 228 54, B23K1/018
Patent
active
059018984
ABSTRACT:
The misapplication or misplacement of solder bumps on chips and/or circuit boards presents financially significant waste and cost efficiency problems in the manufacture of electronic components. The present invention describes an article and a process for using the article to more quickly remove such spurious solder during manufacture of components. The present invention may comprise an article for assisting in the removal of solder from a surface comprising: a) a surface layer of textured material which can be wet by molten solder, b) a first thermally conductive layer having a surface which is in thermal contact with said surface layer, and c) preferably a flux which is present on at least one of said surface layer and said thermally conductive layer having a surface in thermal contact with said surface layer. The article may be preferably provided where the first thermally conductive layer comprises a sheet of flexible, thermally conductive metal, especially aluminum. The performance of the article may be generally enhanced by providing the thermally conductive layer as a metallic layer with its surface having a layer of material which can be wet by molten solder.
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Easy-Braid Company
Gamino Carlos J.
Ryan Patrick
LandOfFree
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