System for removing material from semiconductor wafers using a c

Details System for removing material from semiconductor wafers using a c System for removing material from semiconductor wafers using a c

1991-05-07

1993-10-19

Paschall, Mark H.

Electric heating

Metal heating

By arc

21912141, 21912159, 21912154, 156646, 156345, 20429832, B23K 900

Patent

active

052548309

ABSTRACT:
A system for thinning wafers includes thickness measuring apparatus that provides information to a computer for generating a memory map of the wafer surface. The memory map is used to control a material removal apparatus that thins the wafer to a uniform thickness.

REFERENCES:
patent: 4550242 (1985-10-01), Uehara et al.
patent: 4713259 (1987-12-01), Gartner et al.
patent: 4758304 (1988-07-01), McNeil et al.
patent: 4816638 (1989-03-01), Ukai et al.

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