System for reducing oxidation of electronic devices

Metal working – Barrier layer or semiconductor device making

Reexamination Certificate

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Details

C228S042000

Reexamination Certificate

active

10764162

ABSTRACT:
The invention provides a system for reducing oxidation of a semiconductor device when it is heated, for example during wire bonding. A holding device is provided for securing the semiconductor device to a platform. The holding device includes an opening for providing access to an area where the semiconductor device is to be heated and a cavity is coupled to the opening. A gas inlet in fluid communication with the cavity supplies a relatively inert gas to the cavity, whereby to transmit the inert gas to the opening through the cavity and to reduce oxidation of the semiconductor device.

REFERENCES:
patent: 5265788 (1993-11-01), Ozawa et al.
patent: 5364007 (1994-11-01), Jacobs et al.
patent: 5569075 (1996-10-01), Leturmy
patent: 6866182 (2005-03-01), Wong et al.

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