System for real-time control of semiconductor wafer polishing in

Details System for real-time control of semiconductor wafer polishing in System for real-time control of semiconductor wafer polishing in

1997-01-30

1998-03-24

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 2, 451 41, 451285, 451286, 451287, 451288, 451289, B24B 4900

Patent

active

057306427

ABSTRACT:
A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system delivering a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly; and an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, wherein drying of the wafer is avoided while the measurements are taken.

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Specification of The Nova Scan 210: Integrated Thickness Monitoring System.

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