System for real-time control of semiconductor wafer polishing in

Details System for real-time control of semiconductor wafer polishing in System for real-time control of semiconductor wafer polishing in

1997-03-21

1998-06-09

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

451 41, 451285, 451286, 451287, 451288, 451289, 451 53, 451446, B24B 2900

Patent

active

057625379

ABSTRACT:
A system for polishing a semiconductor wafer, the system comprising a platen subassembly defining a polishing area; a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and means for heating the wafer while the wafer face is being polished.

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Specification of The NoveScan 210: Thickness Monitoring System .

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