System for real-time control of semiconductor wafer polishing in

Details System for real-time control of semiconductor wafer polishing in System for real-time control of semiconductor wafer polishing in

1995-10-24

1997-08-19

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 6, 451287, 451288, 451289, 356381, 356382, 25055927, 25055928, B24B 4900, B24B 5100

Patent

active

056581831

ABSTRACT:
A system for polishing a semiconductor wafer, the system comprising a wafer polishing assembly for polishing a face of a semiconductor wafer at a polishing rate and a polishing uniformity, the wafer polishing assembly including a platen subassembly defining a polishing area, a slurry supply system delivering a slurry to the polishing area, and a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly; and an optical measurement system measuring film thickness at multiple different locations on the wafer face while the wafer is under a liquid, wherein drying of the wafer is avoided while the measurements are taken.

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Specification of The NovaScan 210: Integrated Thickness Monitoring System.

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